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Wafer Level Chip Size Packages (W-CSP)
» Overview
» Comparison
» Benefits of W-CSP
» Oki's W-CSP Products
» ASIC W-CSP Technology Advantages
» Technical Information Overview
Oki's W-CSP offers design engineers a thinner, smaller, lighter weight packaging option to help solve today's critical design issues. The demand for smaller, more portable products with increased functionality is fueling growth in many markets and applications. This demand has helped make W-CSP one of the fastest growing areas of IC packaging technology.
Comparison
| Chip Size 8 x 8 mm |
144 Pin LQFP |
144 Pin FBGA |
144 Pin W-CSP |
| Pin Pitch |
0.5 mm |
0.8 mm |
0.5 mm |
| Package Size |
20 x 20 mm |
13 x 13 mm |
8 x 8 mm |
| Mounting Area |
484 mm2 |
169 mm2 |
64 mm2 |
| Package Weight |
1.4 g |
0.3 g |
0.08 g | |
For detailed development flow, test and reliability information download theW-CSP technical overview.pdf
Benefits of W-CSP
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High performance real chip size package |
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Wafer level processing |
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Smaller, thinner package size that addresses critical end product footprint (size) requirements |
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Reduced chip weight and therefore reduces the weight of the end product |
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Reduced die size (100% die shrink) |
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Oki's W-CSP offers pitch sizes down to 0.4 mm pitch |
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Oki's W-CSP has the same or improved reliability as conventional packages |
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Environmentally safe including the option for Pb free and Halogen free |
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No special handling is required |
Oki's W-CSP Products
| Size |
Pitch |
Pin Count |
Device |
Application |
Status |
| 6.3 |
4.3 |
0.5 |
79 |
MCU |
Watch |
Volume Production |
| 6.3 |
4.3 |
0.4 |
111 |
MCU |
Watch |
Volume Production |
| 6.3 |
6.3 |
0.8 |
48 |
Speech |
PHS/Mobile Phone |
Volume Production |
| 6.5 |
6.2 |
0.65 |
48 |
Speech |
IC Recorder |
Volume Production |
| 7.96 |
7.96 |
0.5 |
141 |
AFE |
Mobile Phone |
Volume Production |
| 7.84 |
7.78 |
0.5 |
160 |
Controller |
PC Card |
Volume Production |
| 5.98 |
6.26 |
0.8 |
48 |
Speech |
PHS/Mobile Phone |
Volume Production |
| 4.46 |
4.46 |
0.5 |
48 |
Speech |
PHS/Mobile Phone |
Volume Production |
| 6.96 |
6.96 |
0.5 |
121 |
AFE |
Mobile Phone |
Under Development |
| 6.22 |
6.22 |
0.5 |
83 |
RF |
Mobile Phone |
Under Development |
| 6.57 |
6.3 |
0.5 |
136 |
System Logic |
Data Card |
Under Development |
| 8.52 |
8.23 |
0.5 |
218 |
Base Band |
PHS/Mobile Phone |
Under Development |
| 4.9 |
4.72 |
0.5 |
63 |
RF |
Mobile Phone |
Under Development | |
Download our W-CSP technical overview.pdf or contact an Oki sales office today for more detailed information on the Oki W-CSP choice |
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