ASIC W-CSP Technology Advantages

Engineers are looking for application driven small form factor packaging that can be used for complex featured and functionality rich System-On-Chip designs. Additional requirements include high performance, ultra-thin, ultra-light weight characteristics.  Oki/ChipX offers an ASIC packaging choice W-CSP which is 50% of the size of the fine pitch BGA and 25% of the fine pitch QFP package for the same pin counts.

Oki/ChipX' ASIC W-CSP package choice supports the small form factor requirements of designs
like cell phones, GPS systems, PCMCIA cards, wireless LANs and other mobile applications.  W-CSP packaging also has a 30% shorter lead time than conventional packaging to reduce your overall ASIC design timeline.