Technical issues for lead-free products include:
| o |
Development of lead-free material while maintaining substrate mounting technology |
| o |
Improvement of heat-resistance for IC packages |
| o |
Customers must ensure that the re-flow profile is compatible with remainder of components on their Printed Circuit Board (PCB) |
Production Plan by Package Type:
| Package type |
Abbreviation |
Sample production |
Production availability |
 |
QFP, SOP, DIP, QFJ, SOJ, TQFP, TSOP, SSOP |
NOW |
NOW |
 |
FBGA/FLGA |
NOW |
NOW |
| BGA |
Some select packages NOW |
Several packages are available NOW (check with Marketing) |
Presently, Oki is continuing conventional lead-style product manufacturing and availability. Lead-free products will be clearly distinguished from current products by a package code designator.
Actions under way to make lead-free semiconductor products
Terminal Composition
| Package type |
Current |
Lead-Free |
| Surface-mount type |
Sn-Pb plating |
Sn-Bi plating |
| Sn-Pb ball |
Sn-Ag-Cu ball |
| Through-hole type |
Sn-Pb plating |
Sn-Bi plating |
Mounting Conditions for Lead-Free Products
| � |
In general, mounting with lead-free soldering paste requires increased re-flow temperature.
Current heat resistance of a surface-mount package is designed to resist a maximum re-flow peak temperature of 260�C. However, package templates can vary by product. Please review re-flow profiles for each product |
Oki Technical Paper (in pdf format)
More on Oki's Lead-free Packages
Oki Semiconductor will continue to provide conventional lead-style product manufacturing and availability.
| � |
Oki will continue to follow EOL procedures for those products that will be discontinued. |
A package code designation will be used to identify lead-free products from current products.
| � |
Care of correct ordering part number should be taken for Purchase Order Placement and review. |
